Carbodeon NanoDiamond materials recognised as key for smaller electronic devices
Vantaa, Finland, March 15th, 2016
Thermoplastic materials containing Carbodeon NanoDiamond have been recognised as a key enabler for the next generation of mobile electronics devices. Writing in his blog, plastics industry expert Doug Smock has identified that as the devices get smaller, but with increasing performance and functionality, there will be an increasing requirement for smart thermal management applications. Thermoplastic materials containing Carbodeon's uDiamond® will have combined thermal conductivity and structural properties and can therefore be used to combine the function of a housing and a heat sink, reducing components required and saving space, weight and cost as well as improving the overall thermal management.
Read Doug's blog here: The Moulding Blog